:
, e-mail.
Ba
: 24.01.2007 - 26.01.2007
: -
: Reed Exhibitions Japan
: ,
: Tokyo Big Sight
, .
"Elecon - 2007", "IC Packaging Technology Expo - 2007", "Internepcon - 2007", "Printed Wiring Boards Expo - 2007".
"OPTCOM".
.